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Gigabyte GA-P55A-UD3R Motherboard Core i7 Socket 1156 Intel P55
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Gigabyte GA-P55A-UD3R Motherboard Core i7 Socket 1156 Intel P55

Price: £150.93

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GIGABYTE?s leading 12 phase power VRM design utilizes the highest caliber components to provide unadulterated smooth power delivery for the CPU. GIGABYTE?s 12 phase power design enables better delivery of power to supercharge your system giving power users unparalleled overclocking ability and lower temperatures to reach maximum performance levels. The 12 phase power VRM has been designed and engineered to deliver fast transient response times through quick and seamless power delivery during extensive CPU loading variations. In addition heat from the VRM is effectively reduced by spreading the load between the 12 power phases resulting in a cooler and more stable platform. The GIGABYTE P55A-series motherboards support the latest generation SuperSpeed USB 3.0 technology made possible through an onboard NEC uPD720200 host controller. With superfast transfer rates of up to 5 Gbps users are able to experience an almost a 10x improvement over USB 2.0. Additionally backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices. The onboard NEC SuperSpeed USB 3.0 technology also provides new power management features that include increased maximum bus power and device current draw to better accommodate power-hungry devices. Yet another onboard feature of GIGABYTE P55A motherboards are Marvell?s new SE9128 chips for high-speed SATA Revision 3.0 compatibility delivering superfast 6Gbps link speeds for twice the data transfer rates of SATA Revision 2.0 (3 Gbps). When used in RAID 0 (Stripe) mode GIGABYTE P55A series motherboards offer even faster data transfer rates of up to 4x the speed of current SATA interfaces. GIGABYTE P55A-series motherboards feature a 3x USB power boost delivering greater compatibility and extra power for USB devices. GIGABYTE?s unique USB power design is also able to efficiently regulate output over the full voltage range which greatly enhances USB device compatibility. In addition dedicated lower resistance fuses ensure lower voltage drops and provide more stable and plentiful power delivery. GIGABYTE Ultra Durable 3 design featuring 2 ounces of copper for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. GIGABYTE's Ultra Durable 3 also lowers the PCB impedance by 50% which helps to reduce electrical waste and further lowers component temperatures. A 2oz Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference) providing better system stability and allowing for greater margins for overclocking.



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Last Updated: Tuesday, 07 February 2012 18:48
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